Optical imaging with reduced immersion liquid evaporation effects

ABSTRACT

The present disclosure relates to an optical arrangement for use in an optical imaging process. The optical arrangement includes an optical element, an immersion zone and a liquid repelling device. During the optical imaging process, the immersion zone is located adjacent to the optical element and is filled with an immersion liquid. The optical element has a first surface region and a second surface region. During the optical imaging process, the first surface region is wetted by the immersion liquid. At least temporarily during the optical imaging process, the liquid repelling device generates an electrical field in the region of the second surface. The electrical field being is adapted to cause a repellent force on parts of the immersion liquid which are responsive to the electrical field and inadvertently contact the second surface region. The repellent force has a direction to drive away the parts of the immersion liquid from the second surface region.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of, and claims benefit under 35 USC120 to, U.S. application Ser. No. 14/492,387, filed Sep. 22, 2014, nowU.S. Pat. No. 9,645,513, which is a continuation of, and claims benefitunder 35 USC 120 to, U.S. application Ser. No. 13/285,729, filed Oct.31, 2011, now U.S. Pat. No. 8,934,079, which is a continuation of, andclaims benefit under 35 USC 120 to, international applicationPCT/EP2010/056000, filed May 4, 2010, which claims benefit under 35 USC119 of Great Britain Application No. 0907864.3, filed May 7, 2009 andunder 35 USC 119(e) of U.S. Ser. No. 61/175,072, filed May 4, 2009. U.S.application Ser. Nos. 13/285,729, 14/492,387 and internationalapplication PCT/EP2010/056000 are hereby incorporated by reference intheir entirety.

FIELD

The present disclosure relates to an optical imaging arrangement. Thedisclosure may be used in the context of microlithography used forfabricating microelectronic circuits. Thus, the present disclosure alsorelates to an optical imaging device which, among other things, may beimplemented using such an optical imaging arrangement.

BACKGROUND

Especially in the area of microlithography, apart from the use ofcomponents having a high precision, it is desirable to keep the positionand the geometry of the components of the imaging device, e.g. theoptical elements such as lenses, mirrors and gratings, unchanged duringoperation to the highest possible extent in order to achieve acorrespondingly high imaging quality. The demanding desired propertieswith respect to accuracy (lying in the magnitude of a few nanometers orbelow) are nonetheless a consequence of the permanent desire to reducethe resolution of the optical systems used in fabricatingmicroelectronic circuitry in order to push forward miniaturization ofthe microelectronic circuitry to be produced.

In order to achieve an increased resolution either the wavelength oflight used may be reduced as it is the case with systems working in theextreme UV (EUV) range at working wavelengths in the area of 5 nm to 20nm (typically at about 13 nm) or the numerical aperture of theprojection system used may be increased. One possibility to remarkablyincrease the numerical aperture above the value 1 is realized inso-called immersion systems, wherein an immersion medium having arefractive index larger than 1 is typically placed between the lastoptical element of the projection system and the substrate to beexposed. A further increase in the numerical aperture is possible withoptical elements having a particularly high refractive index.

It will be appreciated that, in a so-called single immersion system, theimmersion element (i.e. the optical element at least in part contactingthe immersion medium in the immersed state) typically is the lastoptical element located closest to the substrate to be exposed. Here,the immersion medium typically contacts this last optical element andthe substrate.

In a so-called double immersion system, the immersion element does notnecessarily have to be the last optical element, i.e. the opticalelement located closest to the substrate. In such double or multipleimmersion systems, and immersion element may also be separated from thesubstrate by one or more further optical elements. In this case, theimmersion medium the immersion element is at least partly immersed inmay be placed, for example, between two optical elements of the opticalsystem.

With the reduction of the working wavelength as well as with theincrease of the numerical aperture not only the desired properties withrespect to the positioning accuracy and the dimensional accuracy of theoptical elements used become more strict throughout the entireoperation. Of course, the desired properties with respect to theminimization of imaging errors of the entire optical arrangementincrease as well.

The deformations of the respective optical element and the imagingerrors resulting therefrom are of special importance in this context.More specifically, it has turned out that evaporation effects of theimmersion liquid contacting the optical element may introduce aconsiderable thermal disturbance into the optical element leading torelatively high local temperature gradients within the optical element.These high local temperature gradients resulting in considerablestresses introduced into the optical element which in turn will lead toincreased imaging errors.

These evaporation effects are especially undesired at (ideally) dryareas of the immersion element which, under ideal conditions, should notbe wetted by the immersion medium. However, since under real operatingconditions the substrate to be exposed at certain points in time has toexecute comparatively fast relative movements with respect to theimmersion element, kinetic energy is transferred to the immersion mediumleading to a certain sloshing movement of the immersion bath. Thissloshing movement leads to an inadvertent wetting of these dry areaswith parts of the immersion medium such as thin immersion liquid filmsor immersion liquid splashes etc. These typically randomly distributedand hardly predictable films or splashes are prone to easily evaporateleading to the undesired result on the imaging errors as outlined above.

To solve this problem it has been proposed to provide hydrophobiccoatings at these dry areas of the immersion element to reduce theamount of immersion liquid which may contact the immersion elementsufficiently long to evaporate and, thus, introduce a noticeable thermaldisturbance into the immersion element. However, despite theirhydrophobic properties, the use of such coatings has to rely on thegravitational force acting on the immersion liquid splashes or films toprovide rapid removal of the immersion medium from the dry areas. Thus,particularly under unfavorable geometric conditions, these hydrophobiccoatings may not be sufficient to provide rapid removal of the immersionmedium prior to noticeable evaporation.

SUMMARY

The present disclosure provides an optical arrangement and an opticalimaging device, respectively, which can exhibit improved properties,such as reduced immersion liquid evaporation effects and, consequently,improved imaging quality.

The present disclosure is based on the finding that an improvedreduction of the effects of immersion liquid evaporation may be achievedby using an electrical field to which the immersion liquid is responsivein such a manner that a repellent force is exerted at least on the partsof the immersion liquid inadvertently contacting the (ideally) dry areasof the immersion element. Using the electrical field the repellent forcemay easily be adjusted to quickly drive the undesired parts of theimmersion liquid away from the dry areas. In particular, this repellentforce may be achieved irrespective of the spatial orientation of the dryarea. Thus, even horizontally oriented dry areas may be easily clearedfrom such immersion liquid films or splashes. In other words, using thedisclosure, clearance from such immersion liquid films or splashes mayeven be achieved under conditions where gravity based solutionstypically do not provide the desired result.

It will be appreciated that gravity may assist the repellent forceprovided by the electrical field used according to the presentdisclosure. In other words, it is sufficient that the repellent forceresulting from the electrical field triggers or induces, respectively, amotion of the immersion liquid parts to such an extent that furthermotion of the undesired immersion liquid parts away from the dry area isat least assisted or, beyond a certain point, predominantly or evenfully provided by gravity.

The present disclosure provides an optical arrangement for use in anoptical imaging process. The optical arrangement includes an opticalelement, an immersion zone and a liquid repelling device. During theoptical imaging process, the immersion zone is located adjacent to theoptical element and is filled with an immersion liquid. The opticalelement has a first surface region and a second surface region. Duringthe optical imaging process, the first surface region is wetted by theimmersion liquid. At least temporarily during the optical imagingprocess, the liquid repelling device generates an electrical field inthe region of the second surface. The electrical field is adapted tocause a repellent force on parts of the immersion liquid beingresponsive to the electrical field and inadvertently contacting thesecond surface region. The repellent force has a direction to drive awaythe parts of the immersion liquid from the second surface region.Contact time between the second surface region and the parts of theimmersion liquid is at least shortened leading to a reduction of theundesired evaporation effects as outlined above.

The present disclosure also provides an optical element for use in anoptical imaging process. The optical arrangement includes an opticalelement body, a first surface region and a second surface region. Thefirst surface region is adapted to be wetted by an immersion liquidresponsive to an electrical field during the optical imaging process. Atleast one electrically conductive element is mechanically connected tothe optical element body in the region of at least one of the firstsurface region and the second surface region. The at least oneelectrically conductive element is adapted to participate in generatingthe electrical field.

The present disclosure also provides an optical imaging device, inparticular for microlithography, including an illumination device, amask device for receiving a mask including a projection pattern, anoptical projection device including an optical element group and asubstrate device for receiving a substrate. The illumination deviceilluminates the projection pattern while the optical element groupprojects the projection pattern onto the substrate. The opticalprojection device further includes an optical arrangement according tothe present disclosure.

The present disclosure also provides a method of reducing liquidevaporation effects at a surface of an optical element during an opticalimaging process. The method includes providing the optical element andan immersion liquid. The optical element has a first surface region anda second surface region. During the optical imaging process, the firstsurface region is wetted by the immersion liquid. At least temporarilyduring the optical imaging process, an electrical field is generated inthe region of the second surface. The electrical field causes arepellent force on parts of the immersion liquid being responsive to theelectrical field and inadvertently contacting the second surface region.The repellent force has a direction to drive away the parts of theimmersion liquid from the second surface region.

Further features and preferred embodiments of the disclosure becomeapparent from the dependent claims and the following description ofpreferred embodiments given with reference to the appended drawings,respectively. All combinations of the features disclosed, whetherexplicitly recited in the claims or not, are within the scope of thedisclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic representation of a preferred embodiment of theoptical imaging device according to the disclosure using which thepreferred embodiment of the method of reducing liquid evaporationeffects at a surface of an optical element according to the disclosuremay be executed;

FIG. 2 is a schematic partial section of a part of the imaging device ofFIG. 1;

FIG. 3 is a block diagram of a preferred embodiment of the method ofreducing liquid evaporation effects at a surface of an optical elementaccording to the disclosure which may be executed with the opticalimaging device of FIG. 1;

FIG. 4 is a schematic partial section of a part of a further preferredembodiment of the optical imaging device according to the disclosure.

DETAILED DESCRIPTION First Embodiment

In the following, a first preferred embodiment of the optical imagingdevice according to the disclosure including a preferred embodiment ofthe optical arrangement according to the disclosure will be describedwith reference to the FIGS. 1 to 3.

FIG. 1 is a schematic representation of a preferred embodiment of theoptical imaging device according to the disclosure in the form of amicrolithography device 101 operating with light in the UV range havinga wavelength of 193 nm.

The microlithography device 101 includes an illumination system 102, amask device with a mask table 103, an optical projection system in theform of an objective 104 having an optical axis 104.1 and a substratedevice 105. In an exposure or optical imaging process performed with themicrolithography device 101 the illumination system 102 illuminates amask 103.1 arranged on the mask table 103 with a projection light beam(not shown in further detail) having a wavelength of 193 nm. Aprojection pattern is formed on the mask 103.1 which is projected by theprojection light beam via the optical elements arranged within theobjective 104 onto a substrate in the form of a wafer 105.1 arranged ona wafer table 105.2 of the substrate device 105.

The objective 104 includes an optical element group 106 formed by aseries of optical elements 107, 108. The optical elements 107, 108 areheld within the housing 104.2 of the objective 104. Due to the workingwavelength of 193 nm the optical elements 107, 108 are refractiveoptical elements such as lenses or the like. The last optical element108 located closest to the wafer 105.1 during the optical imagingprocess is a so called closing element or last lens element.

The microlithography device 101 is an immersion system. Thus, in animmersion zone 109, a liquid immersion medium 109.1, for example highlypurified water or the like, is arranged between the wafer 105.1 and thelast lens element 109. Within the immersion zone 109 there is providedan immersion bath of the immersion medium 109.1 on the one handdownwardly delimited at least by the part of the wafer 105.1 to beactually exposed. The lateral limitation on the immersion bath isprovided at least partially by an immersion frame 109.2 (typically alsocalled an immersion hood). At least the part of the last lens element108 optically used during exposure and lying on the outer side of theobjective 104 is immersed in the immersion bath such that the last lenselement 108 is an immersion element in the sense of the presentdisclosure. Thus, the path of the light exiting from the last lenselement 108 between the last lens element 108 and the wafer 105.1 islocated exclusively within the immersion medium 109.1.

Because the refractive index of the immersion medium 109.1 is greaterthan one, a numerical aperture NA>1 is achieved and the resolution isenhanced with respect to a conventional system with a gas atmospherebetween the last lens element and the wafer. FIG. 2, in a schematicpartial sectional view of a part of the microlithography device 101 inthe region of the immersion element 108, shows a preferred embodiment ofthe optical arrangement 110 according to the disclosure. As can be seenbest from FIG. 2, the immersion element 108 (forming part of the opticalarrangement 110) has a first surface region 108.1 which is contactedand, thus, wetted by the immersion liquid 109.1 (also forming part ofthe optical arrangement 110) during the optical imaging process.Consequently, in the following, this first surface region 108.1 is alsocalled the wet surface region of the immersion element 108.

Furthermore, the immersion element 108 has a second surface region 108.2which is located adjacent to the first surface region 108.1 and, underideal or static conditions during the optical imaging process, shouldnot be contacted by the immersion bath. Consequently, in the following,this second surface region 108.2 is also called a (ideally) dry surfaceregion of the immersion element.

However, since under real operating conditions of the microlithographydevice 101, the wafer 105.1 to be exposed at certain points in time hasto execute comparatively fast relative movements with respect to theimmersion element 108 (in the x- and y-direction), kinetic energy istransferred to the immersion medium 109.1 leading to a certain sloshingmovement of the immersion bath. This sloshing movement leads to aninadvertent wetting of the dry surface region 108.2 with parts of theimmersion medium such as thin immersion liquid films, immersion liquidsplashes or immersion liquid drops etc. as it is indicated in anexemplary way by the immersion liquid drop 109.3 in FIG. 2. Thesetypically randomly distributed and hardly predictable films or splashesare prone to easily evaporate leading to high local temperaturegradients within the immersion element 108 and, consequently, to theundesired effect of increasing the imaging errors introduced into theimaging process via the immersion element 108 as has been outlined indetail above.

In order to at least reduce these evaporation effects the opticalarrangement 111 includes a liquid repelling device 111. The liquidrepelling device 111 serves to exert a repellent force F on the parts ofthe immersion liquid 109.1 inadvertently contacting the dry surfaceregion 108.2 such as, for example, the immersion liquid drop 109.3. Ascan be seen from FIG. 2, this repellent force F has a direction whichhelps to quickly drive the drop 109.3 inadvertently contacting the drysurface region 108.2 away from the dry surface region 108.2. By thisapproach, the contact time between the dry surface region 108.2 and thedrop 109.3 is at least shortened leading to a reduced local cooling ofthe immersion element 108 (caused by the evaporation of parts of thedrop 109.3 or even the entire drop 109.3).

The liquid repellent device 111, in the embodiment shown in FIG. 2,achieves this repellent force F via a field generating element in theform of an electrically conductive element 111.1 located in the wetsurface region 108.1. The electrically conductive element 111.1 isformed by a layer of a coating formed on the outer surface 108.3 of theoptical element body 108.4 of the immersion element 108. The coating111.1 is made of an electrically conductive material including(exclusively or in an arbitrary combination) chromium (Cr), aluminium(Al), titanium (Ti), hafnium (Hf), nickel (Ni) or any other electricallyconductive material which is approved for use in the specific opticalimaging application performed with the device 101 (i.e. here: any otherelectrically conductive material which is approved for use inmicrolithography applications).

The electrically conductive element 111.1 generates a first electricalfield E1 to which the immersion liquid 109.1 is responsive leading tothe repellent force F acting on the drop 109.3. In the embodiment shown,the electrical field E1 is generated by electrostatically charging theelectrically conductive element 111.1. This is done via a first fieldgenerating device 111.2 that temporarily electrically contacts theelectrically conductive element 111.1 in order to provide theelectrostatic charge at the electrically conductive element 111.1.

The polarity of the electrostatic charge at the electrically conductiveelement 111.1 depends on the immersion liquid and the repellent force Fto be exerted on the drop 109.3. In the embodiment shown in FIG. 2, withthe electrically conductive element 111.1 being arranged in the wetsurface region 108.1, the repellent force F is provided by an attractiveforce acting between the drop 109.3 and the electrically conductiveelement 111.1 and provoked by the electrostatic charge of theelectrically conductive element 111.1.

In the embodiment shown in FIG. 2, the electrically conductive element111.1 is provided with a negative (or positive) electrical charge suchthat the desired repellent force F is achieved in the interactionbetween the inhomogeneous electrostatic field (showing a field gradientbetween 100 V/m² and 10000 V/m², preferably between 500 V/m² and 5000V/m²) produced by the electrically charged element 111.1 and theimmersion liquid 109.1 which is electrically polarized by theelectrostatic field of the electrically charged element 111.1 (i.e.shows an orientation of the electrical dipoles in the highly purifiedwater used as the immersion liquid 109.1 as a result of the fieldproduced by the electrically charged element 111.1).

In this context the following basic considerations apply. An immersionliquid droplet 109.3 sitting on the dry surface region 108.2 and havinga radius r=2 mm is subject to attraction forces A (due to its prevailingsurface energy SE of about 80·10⁻³ N/m resulting from its the surfacetension and the interaction with the surface of the surface region108.2) lying in the order of magnitude of 1 mN according to theequation:

$\begin{matrix}{A = {{2 \cdot \pi \cdot r \cdot {SE}} = {{2 \cdot \pi \cdot \left( {{2 \cdot 10^{- 3}}m} \right) \cdot \left( {{80 \cdot 10^{- 3}}\frac{N}{m}} \right)} \approx {{1 \cdot 10^{- 3}}N}}}} & (1)\end{matrix}$

The static frictional forces to be overcome lie in the order ofmagnitude of 1 mN to 1·10⁻³ mN.

A point-shaped electric charge Q generates an electrical field E at adistance d according to the following equation:

$\begin{matrix}{{E = {\frac{Q}{4 \cdot \pi \cdot ɛ_{0}} \cdot \frac{1}{r^{2}}}},} & (2)\end{matrix}$wherein ε₀=8.85·10⁻¹² C/(V·m) is the electric constant (also referred toas vacuum permittivity). Accordingly, the electric field gradient dE/dris calculated according to the following equation:

$\begin{matrix}{\frac{dE}{dr} = {\frac{Q}{2 \cdot \pi \cdot ɛ_{0}} \cdot {\frac{1}{r^{3}}.}}} & (3)\end{matrix}$

In a rough approximation, a water droplet in an electric field Eundergoes an electric polarization P according to the followingequation:P=ε ₀·(ε_(r)−1)·E,  (4)wherein ε_(r) is the relative static permittivity (also referred to asdielectric constant). Thus, with a relative static permittivity ε_(r)=80for a water droplet, using equations (2) to (4) the force on such aelectrically polarized water droplet is calculated according to thefollowing equation:

$\begin{matrix}{F = {{P \cdot \frac{dE}{dr}} = {\frac{Q^{2} \cdot \left( {ɛ_{r} - 1} \right)}{8 \cdot \pi \cdot ɛ_{0} \cdot r^{5}}.}}} & (5)\end{matrix}$

Thus, a point-shaped electric charge of Q=1 nC (=1.9·10¹⁰ e, with ebeing the elementary charge), at a distance d=0.1 m, provokes anelectric field E=900 V/m and an electric field gradient dE/dr=1.8·10⁴V/m². Thus, the water droplet, in a first approximation, undergoes adipole moment of 6.3·10⁻⁷ Cm. The resulting force exerted on the waterdroplet is thus F=11·10⁻³N. Thus, it is preferred to have a fieldgradient between 100 V/m² and 10000 V/m², preferably between 500 V/m²and 5000 V/m².

However, it will be appreciated that, with other embodiments of thedisclosure, the immersion medium itself may be provided with acorresponding electrical charge (by a suitable mechanism) in order toachieve the desired repellent force F. Apparently, the electrical chargeof the electrically conductive element is then selected as a function ofthe electrical charge of the immersion medium (and vice versa).

In this context the following basic considerations apply. In anelectrically charged immersion medium the force F acting on the droplethaving an electric charge Q in an electric field E is calculatedaccording to the following equation:F=E·Q.  (6)

Thus, in order to achieve a force F=1·10⁻³N in an electric field E=1·10³V/m, an electric charge of Q=1·10⁻⁶ C is used.

It will be appreciated that the electrical charge of the electricallyconductive element 111.1 may be provided only once provided that nosubstantial loss in the charge is to be expected over the lifetime ofthe system. However, as shown in FIG. 2, the field generating device111.2 is adapted to electrically contact the electrically conductiveelement 111.1 from time to time (e.g. between the exposure of differentwafers 105.1) in order to maintain the electrostatic charge at theelectrically conductive element 111.1 at the desired level.

In order to prevent discharge of the electrically conductive element111.1 an electrically insulating element 111.3 is provided on the thirdsurface region 111.4 of the electrically conductive element 111.1 facingthe immersion liquid 109.1. The electrically insulating element 111.3may be formed from any suitable electrically insulating material whichis approved for use in the specific optical imaging applicationperformed with the device 101 (i.e. here: any other electricallyinsulating material which is approved for use in microlithographyapplications).

The electrically insulating element 111.3 is formed by a layer of acoating formed on the outer surface 111.4 of the electrically conductiveelement 111.1. The coating 111.3 is made of an electrically insulatingmaterial including (exclusively or in an arbitrary combination) silicondioxide (SiO₂), aluminum oxide (Al₂O₃), hafnium oxide (HfO₂), tantalumpentoxide (Ta₂O₅) or any other suitable electrically insulatingmaterial.

It will be appreciated that the silicon dioxide (SiO₂) also has theadvantage that it is a hydrophilic material leading to good wettingproperties at the wet surface region 108.1. However, it will beappreciated that, with other embodiments of the disclosure, acombination of at least one electrically insulating layer and at leastone hydrophilic layer may be chosen for the electrically insulatingelement.

It will be further appreciated that, with other embodiments of thedisclosure, the electrically conductive element may also be fullyembedded in such an electrically insulating element in order to preventdischarge to the largest possible extent.

The electrically conductive element 111.1 ends in the region where thefree surface 109.4 of the immersion bath is ideally located, i.e. at thetransition between the wet surface region 108.1 and the dry surfaceregion 108.2. Thus, a good assistance of the removal of the immersionliquid parts from the dry surface region 108.2 by the repellent force Fis achieved.

As can be seen from FIG. 2, in the embodiment shown, the optical elementbody 108.4 is further provided with a hydrophobic coating 112 in the drysurface region 108.2 further promoting removal of the inadvertentimmersion liquid parts from the dry surface region 108.2. However, withother embodiments of the disclosure, such a hydrophobic coating may alsobe omitted.

It will be appreciated that, with other embodiments of the disclosure,instead or in addition to the electrically conductive element 111.1 anelectrically conductive element (generating or contributing to theelectric field provoking the repellent force F) may also be provided ata location other than the immersion element, e.g. at the immersion frame109.2 as it is indicated by the dashed contour 113 in FIG. 2. Theimplementation and principle of operation of such an electricallyconductive element 113 is identical to the one of the electricallyconductive element 111.1 such that it is here only referred to theexplanations given above.

It will be appreciated that, with other embodiments of the disclosure,instead of a single electrically conductive element 111.1 a plurality ofelectrically conductive elements may be used in the liquid repellingdevice. Furthermore, different sizes and/or shapes and/or materials (ina virtually arbitrary combination) may be chosen for these electricallyconductive elements depending, in particular, on the electrical field tobe generated.

It will be further appreciated that the repellent force F may beachieved irrespective of the spatial orientation of the dry surfaceregion 108.2. Thus, even horizontally oriented dry surface regions maybe easily cleared from such immersion liquid drops 109.3. In otherwords, using the disclosure, clearance from such immersion liquid films,splashes or drops may even be achieved under conditions where gravitybased solutions typically do not provide the desired result.

It will be further appreciated that gravity may assist the repellentforce F provided by the liquid repelling device 110 according to thepresent disclosure. In other words, it is sufficient that the repellentforce F triggers or induces, respectively, a motion of the immersionliquid parts 109.3 to such an extent that further motion of theundesired immersion liquid parts 109.3 away from the dry surface region108.2 is at least assisted or, beyond a certain point, predominantly oreven fully provided by gravity.

It will be further appreciated that, in addition to promoting removal ofthe drop 109.3 from the dry surface, the liquid repelling device 111,due to the repellent force F generated, also helps to prevent formationof such immersion liquid parts at the dry surface region as a result ofthe sloshing movement of the immersion liquid.

FIG. 3 shows a block diagram of a preferred embodiment of an opticalimaging method which may be executed with the microlithography device101 and includes a method of reducing liquid evaporation effects at asurface of an optical element during an optical imaging processaccording to the disclosure.

First, in a step 114.1 execution of the method starts. In a step 114.2the components of the microlithography device 101 are mutuallypositioned with respect to each other such that the configurationdescribed above is achieved.

In a step 114.3 at least a part of the projection pattern on the mask103.1 is projected onto the wafer 105.1 in the manner as it has beendescribed above. In a step 114.3, in parallel to this projection, theliquid repellent force F is generated by the liquid repelling device 111as it has been described above.

In a step 114.5 it is checked if execution of the method is to bestopped. If this is the case, execution of the method is stopped in astep 114.6. Otherwise it is jumped back to step 114.3.

Second Embodiment

In the following a second preferred embodiment of an optical arrangement210 according to the disclosure will be described with reference toFIGS. 1, 3 and 4. The optical arrangement 210 may replace the opticalarrangement 110 in the microlithography device 101 of FIG. 1. Theoptical arrangement 210 in its basic design and functionality largelycorresponds to the optical arrangement 110 such that it will be mainlyreferred to the differences only. In particular, similar components aregiven the same reference numerals raised by the amount 100. In casenothing else is stated in the following with respect to the propertiesof such components it is here referred to the explanations given above.

FIG. 4, in a schematic partial sectional view similar to FIG. 2, showsthe optical arrangement 210. As can be seen best from FIG. 4, theimmersion element 108 (forming part of the optical arrangement 210)again has a wet first surface region 108.1 which is contacted and, thus,wetted by the immersion liquid 109.1 (also forming part of the opticalarrangement 210) during the optical imaging process. Furthermore, theimmersion element 108 again has a dry second surface region 108.2 whichis located adjacent to the first surface region 108.1 and, under idealor static conditions during the optical imaging process, should not becontacted by the immersion bath.

In order to at least reduce the evaporation effects of immersion liquidfilms, immersion liquid splashes or immersion liquid drops 109.3 theoptical arrangement 211 includes a liquid repelling device 211. Theliquid repelling device 211 serves to exert a repellent force F on theparts of the immersion liquid 109.1 inadvertently contacting the drysurface region 108.2 such as, for example, the immersion liquid drop109.3. As can be seen from FIG. 3, this repellent force F has adirection which helps to quickly drive the drop 109.3 inadvertentlycontacting the dry surface region 108.2 away from the dry surface region108.2. By this approach, the contact time between the dry surface region108.2 and the drop 109.3 is at least shortened leading to a reducedlocal cooling of the immersion element 108 (caused by the evaporation ofparts of the drop 109.3 or even the entire drop 109.3).

The liquid repellent device 211, in the embodiment shown in FIG. 4,achieves this repellent force F via a field generating element in theform of an electrically conductive element 211.1 located in the drysurface region 108.2. The electrically conductive element 211.1 isformed by a layer of a coating formed on the outer surface 108.3 of theoptical element body 108.4 of the immersion element 108. The coating211.1 is made of an electrically conductive material including(exclusively or in an arbitrary combination) chromium (Cr), aluminium(Al), hafnium (Hf), titanium (Ti), nickel (Ni) or any other electricallyconductive material which is approved for use in the specific opticalimaging application performed with the device 101 (i.e. here: any otherelectrically conductive material which is approved for use inmicrolithography applications).

The electrically conductive element 211.1 generates a first electricalfield E1 to which the immersion liquid 109.1 is responsive leading tothe repellent force F acting on the drop 109.3. In the embodiment shown,the electrical field E1 is generated by electrostatically charging theelectrically conductive element 211.1. This is done via a first fieldgenerating device 211.2 that temporarily electrically contacts theelectrically conductive element 211.1 in order to provide theelectrostatic charge at the electrically conductive element 211.1.

The polarity of the electrostatic charge at the electrically conductiveelement 211.1 depends on the immersion liquid and the repellent force Fto be exerted on the drop 109.3. In the embodiment shown in FIG. 4, withthe electrically conductive element 211.1 being arranged in the drysurface region 108.2, the repellent force F is provided by a repulsiveforce acting between the drop 109.3 and the electrically conductiveelement 211.1 and provoked by the electrostatic charge of theelectrically conductive element 211.1.

In the embodiment shown in FIG. 4, the electrically conductive element211.1 is provided with a negative (or positive) electrical charge suchthat the desired repellent force F is achieved in the interaction withan electrical polarity of the immersion liquid 109.1 formed by anorientation of the electrical dipoles in the highly purified water usedas the immersion liquid 109.1. This polarity in the immersion liquid109.1 is achieved via a second electrical field E2 generated by afurther, second field generating device 211.5 of the liquid repellingdevice 211.

However, it will be appreciated that, with other embodiments of thedisclosure, the immersion medium itself may be provided with acorresponding electrical charge (by a suitable mechanism) in order toachieve the desired repellent force F. Apparently, the electrical chargeof the electrically conductive element is then selected as a function ofthe electrical charge of the immersion medium (and vice versa).

It will be appreciated that the electrical charge of the electricallyconductive element 211.1 may be provided only once provided that nosubstantial loss in the charge is to be expected over the lifetime ofthe system. However, as shown in FIG. 3, the field generating device211.2 is adapted to electrically contact the electrically conductiveelement 211.1 from time to time (e.g. between the exposure of differentwafers 105.1) in order to maintain the electrostatic charge at theelectrically conductive element 211.1 at the desired level.

In order to prevent discharge of the electrically conductive element211.1 an electrically insulating element 211.3 is provided on the thirdsurface region 211.4 of the electrically conductive element 211.1 facingthe immersion liquid 109.1. The electrically insulating element 211.3may be formed from any suitable electrically insulating material whichis approved for use in the specific optical imaging applicationperformed with the device 101 (i.e. here: any other electricallyinsulating material which is approved for use in microlithographyapplications).

The electrically insulating element 211.3 is formed by a layer of acoating formed on the outer surface 211.4 of the electrically conductiveelement 211.1. The coating 211.3 is made of an electrically insulatingmaterial including (exclusively or in an arbitrary combination) ahydrophobic material like diamond-like-carbon (DLC) or Teflon-likematerial or of hydrophilic material like SiO₂, Al₂O₃ or Ta₂O₅ or anyother suitable electrically insulating material ultimately covered withan additional hydrophobic material.

It will be appreciated that the electrically insulating materialpreferably is a hydrophobic material leading to good liquid removalproperties at the dry surface region 108.2. However, it will beappreciated that, with other embodiments of the disclosure, acombination of at least one electrically insulating layer and at leastone hydrophobic layer may be chosen for the electrically insulatingelement.

It will be further appreciated that, with other embodiments of thedisclosure, the electrically conductive element may also be fullyembedded in such an electrically insulating element in order to preventdischarge to the largest possible extent.

The electrically conductive element 211.1 ends in the region where thefree surface 109.4 of the immersion bath is ideally located, i.e. at thetransition between the wet surface region 108.1 and the dry surfaceregion 108.2. Thus, a good assistance of the removal of the immersionliquid parts from the dry surface region 108.2 by the repellent force Fis achieved.

As can be seen from FIG. 4, in the embodiment shown, the optical elementbody 108.4 is further provided with a hydrophilic coating 212 in the wetsurface region 108.1 promoting good wetting of the wet surface 108.1.However, with other embodiments of the disclosure, such a hydrophiliccoating may also be omitted.

It will be appreciated that, with other embodiments of the disclosure,instead or in addition to the electrically conductive element 211.1 anelectrically conductive element (generating or contributing to theelectric field provoking the repellent force F) as it has been describedin the context of the first embodiment may also be provided as it isindicated by the dashed contour 214 in FIG. 4. The implementation andprinciple of operation of such an electrically conductive element 214 isidentical to the one of the electrically conductive element 111.1 suchthat it is here only referred to the explanations given above.

It will be appreciated that, with other embodiments of the disclosure,instead of a single electrically conductive element 211.1 a plurality ofelectrically conductive elements may be used in the liquid repellingdevice. Furthermore, different sizes and/or shapes and/or materials (ina virtually arbitrary combination) may be chosen for these electricallyconductive elements depending, in particular, on the electrical field tobe generated.

It will be further appreciated that the repellent force F may beachieved irrespective of the spatial orientation of the dry surfaceregion 108.2. Thus, even horizontally oriented dry surface regions maybe easily cleared from such immersion liquid drops 109.3. In otherwords, using the disclosure, clearance from such immersion liquid films,splashes or drops may even be achieved under conditions where gravitybased solutions typically do not provide the desired result.

It will be further appreciated that gravity may assist the repellentforce F provided by the liquid repelling device 210 according to thepresent disclosure. In other words, it is sufficient that the repellentforce F triggers or induces, respectively, a motion of the immersionliquid parts 109.3 to such an extent that further motion of theundesired immersion liquid parts 109.3 away from the dry surface region108.2 is at least assisted or, beyond a certain point, predominantly oreven fully provided by gravity.

It will be appreciated that the methods described above with referenceto FIG. 3 may also be executed with the second embodiment such that itis here only referred to the explanations given above.

In the foregoing, the present disclosure has been described via exampleswhere the electrical field provoking the repellent force is anelectrostatic field. However, it will be appreciated that the disclosuremay also be implemented using electrodynamic fields to which theimmersion liquid is responsive generating the desired repellent force F.

In the foregoing, the present disclosure has been described via exampleswherein the optical element group consists of refractive opticalelements exclusively. However, it is to be mentioned here that thedisclosure, in particular in the case of performing the imaging processat different wavelengths, may of course be used with optical elementgroups that include, alone or in an arbitrary combination, refractive,reflective or diffractive optical elements.

Furthermore, it is to be mentioned that, in the foregoing, the presentdisclosure has been described via an example in the area ofmicrolithography. However, it will be appreciated that the presentdisclosure may also be used for any other application and imagingprocess, respectively.

What is claimed is:
 1. An optical arrangement having an immersion zone,the optical arrangement comprising: an optical element having a firstand second surface regions, wherein: the first surface region comprisesa hydrophilic surface part; the second surface region comprises ahydrophobic surface part adjacent the hydrophilic surface part; duringuse of the optical arrangement in an optical imaging process: theimmersion zone is located adjacent to the optical element; the immersionzone is filled with an immersion liquid; and the first surface region isimmersed in the immersion liquid; at least one member selected from thegroup consisting of the hydrophilic surface part and the hydrophobicsurface part comprises a coating of the optical element; the opticalarrangement further comprises an electrically conductive element betweenthe coating and an optical element body of the optical element; and theelectrically conductive element is configured to participate ingenerating an electrical field.
 2. The optical arrangement according toclaim 1, wherein the hydrophilic surface part comprises the hydrophiliccoating of the optical element.
 3. The optical arrangement according toclaim 1, wherein the hydrophobic surface part comprises the hydrophobiccoating of the optical element.
 4. The optical arrangement according toclaim 1, wherein, during use of the optical arrangement in an opticalimaging process, the hydrophilic surface part is immersed in theimmersion liquid while the hydrophobic surface part is not immersed inthe immersion liquid.
 5. The optical arrangement according to claim 1,wherein the coating comprises a multi-layer coating.
 6. The opticalarrangement according to claim 1, wherein the electrical field is anelectrostatic field.
 7. The optical arrangement according to claim 1,wherein the electrically conductive element is located in the region ofthe first surface region, and the electrical field is configured so thatan attractive force acts between parts of the immersion liquidinadvertently contacting the second surface region and the electricallyconductive element.
 8. The optical arrangement according to claim 1,wherein the electrically conductive element is located in the region ofthe second surface region, and the electrical field is configured sothat a repulsive force acts between parts of the immersion liquidinadvertently contacting the second surface region and the electricallyconductive element.
 9. The optical arrangement according to claim 1,further comprising an electrical field generating device, wherein theelectrical field generating device at least temporarily electricallycontacts the electrically conductive element to generate the electricalfield.
 10. The optical arrangement according to claim 1, wherein theoptical imaging process is a micro-lithography process.
 11. An opticalelement, comprising: a hydrophilic surface part and an adjacenthydrophobic surface part; and a further surface part different from boththe hydrophobic surface part and the hydrophilic surface part, whereinthe hydrophilic surface part is configured to be immersed in animmersion liquid during use of the optical element in an optical imagingprocess, and the further surface part comprises an optically usedsurface part configured to be optically used when the optical element isused in the optical imaging process.
 12. The optical element accordingto claim 11, wherein the hydrophilic surface part comprises ahydrophilic coating of the optical element.
 13. The optical elementaccording to claim 11, wherein the hydrophobic surface part comprises ahydrophobic coating of the optical element.
 14. The optical elementaccording to claim 11, wherein, during use of the optical element in anoptical imaging process, the hydrophilic surface part is immersed in animmersion liquid while the hydrophobic surface part is not immersed inthe immersion liquid.
 15. The optical element according to claim 11,wherein at least one member selected from the group consisting of thehydrophilic surface part and the hydrophobic surface part comprises acoating of the optical element.
 16. The optical element according toclaim 15, wherein the coating comprises a multi-layer coating of theoptical element.
 17. The optical element according to claim 15, furthercomprising an electrically conductive element is located between thecoating and an optical element body of the optical element.
 18. Theoptical element according to claim 17, wherein the electricallyconductive element is electrically charged to generate an electrostaticfield.
 19. An optical imaging device, comprising: an illumination deviceconfigured to illuminate a pattern of a mask; and an optical projectiondevice configured to project the projection pattern onto a substrate,wherein the optical projection device comprises an optical elementgroup, and the optical element group comprises an optical elementaccording to claim
 11. 20. A method, comprising: providing the opticalelement according to claim 11 and an immersion liquid; and at leasttemporarily immersing part of the optical element in the immersionliquid during the optical imaging process.
 21. The method of claim 20,wherein the method comprises an optical imaging method.